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CHV2411AQDG
RoHS COMPLIANT
Fully Integrated HBT K-band VCO
GaAs Monolithic Microwave IC In QFN package
Description
The CHV2411A-QDG is a monolithic multifunction for frequency generation. It integrates a X-band "push-push" oscillator with frequency control (VCO) thanks to basecollector diodes, used as varactors, a K-band buffer amplifiers and a divider by 8. The VCO is fully integrated on HBT process. All the active devices are internally self biased. The circuit is fully integrated on InGaP HBT process: 2m emitter length, via holes through the substrate and high Q passive elements. The chip is delivered in a 24 Leads RoHS compliant QFN4x4 package.
Main Features
K-band VCO+K-band buffers+Prescalar/8 Fully integrated VCO (no need for external Resonator Low phase noise High temperature range High frequency stability On chip self biased devices Standard SMD package : 24L-QFN4x4
Main Characteristics
Symbol F_out F_vco IF_out Pout PFI PN Parameter Specified output frequency range Oscillator frequency Output Intermediate frequency Output power at F_out Output power at Intermediate frequency (IF) SSB Phase Noise @ F_out @ 100 kHz 13 -3 Min 24 Typ 24.125 F_out/2 F_out/16 16 0 -90 -80 Max 24.25 Unit GHz GHz GHz dBm dBm dBc/Hz
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHV2411AQDG7254 - 11 Sept 07 1/10 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHV2411AQDG
Electrical Characteristics
Full temperature range VCO & buffer Part
Symbol F_out F_vco V_Tune Parameters Output Frequency range (Operating band) VCO frequency Voltage Tuning range Tuning sensitivity Frequency drift rate Harmonics 1/2 F_out Harmonics 3/2 F_out Harmonics 2 F_out SSB Phase Noise given @ F_out @ 100 KHz Main Output (RF_Out) VSWR Pulling into 2:1 VSWR for all phases Pushing @ within the V_tune range Output Power on RF_out port Positive supply current 13 Min 24 1 250 Typ F_out/2 400 5
K-band VCO
Max 24.25 6 725 -20 -40 -20 -80 8
Unit GHz V MHz/V MHz/ C dBc dBc dBc dBc/Hz MHz MHz/V dBm mA
H1 H3 H4 PN
-90 2:1
P_out
16 140
250 19 170
Prescalar Part
Symbol IF_out Parameters IF Output Frequency Output Power Positive supply current Prescalar Output (IF) VSWR Min -3 Typ F_out/16 0 80 2:1 Max Unit GHz dBm mA
110
General
Symbol VB,V1,VB1,V2,V B2,VD +I (IB1+IB2+I1+I2) Top Parameters Positive supply voltage Total Positive supply current Operating temperature range -40 Min Typ 5 220 Max Unit V mA C
280 +100
All the parameters are specified between 1V and 6V of Tuning Voltage
Remark : The minimum and maximum values take into account the spread due to the operating temperature and process spread. These performance has been obtained with the chip in QFN package assembled on the recommended boards (ref. 96348 B) described in this document. These performances are highly dependent on this environment.
Absolute Maximum Ratings (1)
Symbol V_tune +V +ID +IB1 / +IB2 +I1 / +I2 +IB Top Tstg Parameters Positive Tuning voltage Positive supply voltage Positive supply current (Prescalar) Positive supply current (buffers 2 & 3) Positive supply current (VCO+ buffer 1) Positive supply current (prescalar`s buffer) Operating temperature range (2) Storage temperature range Values 10 6 120 50 / 55 35 / 50 15 -40 to +100 -55 to +125 Unit V V mA mA mA mA C C
(1) Operation of this device above anyone of these parameters may cause permanent damage. Duration < 1s (2) temperature of the back side of the QFN package Ref. : DSCHV2411AQDG7254 - 11 Sept 07 2/10 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band VCO
CHV2411AQDG
Typical QFN measurements on board 95791 (QFN plan)
Remark : The temperature mentioned below is taken at the back side of the QFN package.
Sensitivity versus Vtune
T=100C
T=25 C
T= - 40 C
Output Frequency versus Vtune
T= - 40 C
T=25 C
T=100C
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
3/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHV2411AQDG
K-band VCO
Output Power @24GHz versus Vtune
T=25 C
T= - 40 C
T=100C
IF Output Power versus Vtune
T=100C T=25 C
T= - 40 C
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
4/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band VCO
CHV2411AQDG
Phase Noise vsversus Vtune Phase Noise Tuning Voltage
@ 10 kHz from Carrier
T=25 C
@ 100 kHz from Carrier
Phase Noise vs Offset frequency from carrier Phase Noise versus Offset frequency fromcarrier
0,00 -10,00 -20,00 -30,00 -40,00 P hase N oise (dB z) c/H -50,00 -60,00 -70,00 -80,00 -90,00 -100,00 -110,00 -120,00 -130,00 1,00
- 40C
Over Operating Tuning Range
100C
10,00
100,00
1000,00
Offset Frequency from Carrier (kHz)
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
5/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHV2411AQDG
QFN Outline
K-band VCO
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
6/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band VCO
QFN Pin-out description
Pin number 15,17 2 4 5,11,13,20,21,23 5 11,21 13 20 23 16 2 1,3,6,7,8,9,10,12,14,18, 19,22,24 Pin name GND P VT VB, V1, VB1, VB2,V2, VD VB V1,V2 VB1 VB2 VD RF P Nc F_out F_out/16 IF_out V_Tune +V Symbol Name Ground
CHV2411AQDG
Description
IF output at 1.5 GHz Frequency Tuning Port Positive supply voltage Positive supply voltage of 12 GHz prescalar's buffer Positive supply voltage of the VCO core+1 stage of the 24GHZ buffers nd rd Positive supply voltage of the 2 & 3 stages of the 24GHZ buffers Positive supply voltage of the 4 stages of the 24GHZ buffers Positive supply voltage of the Prescalar RF output at 24 GHz Prescalar output at 1.5 GHz Not connected
th st
External Components and bias configuration (recommended)
Important: Need for a capacitor on the prescalar output port as a DC block (C2).
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
7/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHV2411AQDG
K-band VCO
Recommended Test Fixture (Ref. 96348 B) for measurements over Temperature Range
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
8/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
K-band VCO
ESD sensitivity
Norm MIL-STD-1686C ESD STM5.1-1998 Value HBM Class 1 (<1000V) HBM Class 0 (<250V)
CHV2411AQDG
Package Information
Parameter Package body material Lead finish MSL Rating RoHS-compliant Low stress Injection Molded Plastic 100% matte Sn MSL1
Recommended surface mount package assembly (see UMS AN0017)
For volume production the SMD type package can be treated as a standard surface mount component (please refer to the IPC/JEDEC J-STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution should be taken to perform a good and reliable contact over the whole pad area.
MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS
300 280 260 240 217 220 200 Temperature (C) 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 140 160 180 Time (s) 200 220 240 260 280 300 320 340 360 Maximum Ramp up rate : 3 / second C 30s Max 150 255
Attention: The solder thickness after reflow should be typical 50m [2 mils] and the lateral alignment between the package and the motherboard should be within 50m [2 mils]. It is important for the performance of the product that the whole overlapping area between the motherboard and package pads is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
9/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHV2411AQDG
K-band VCO
Ordering Information
24L-QFN4x4 Lead Free Package :
Stick: XY=20 Tape and reel: XY=21
CHV2411AQDG/XY
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. : DSCHV2411AQDG7254 - 11 Sept 07
10/10
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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